XRT86VX38IB256-F

XRT86VX38IB256-F

Telecom device1 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Origchip NO: 493-XRT86VX38IB256-F
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 249
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Operating Temperature -40°C~85°C
Packaging Bulk
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 1.8V 3.3V
Function Framer, Line Interface Unit (LIU)
Interface E1, J1, T1
Number of Circuits 1
RoHS Status RoHS Compliant

XRT86VX38IB256-F Overview


Saving board space is achieved with the 256-BGA package.Telecommunications equipment is packed using the Bulk method.The mounting type is Surface Mount.Telecommunications equipment consists of 1 circuits.The supply voltage of 1.8V 3.3V can increase efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.

XRT86VX38IB256-F Features


Available in the 256-BGA package

XRT86VX38IB256-F Applications


There are a lot of MaxLinear, Inc. XRT86VX38IB256-F Telecom applications.

  • NIU
  • DECT (Digital European Cordless Telephone) Base Stations
  • Digital Access Cross-connect System (DACs)
  • CSU/DSU E1/T1/J1 Interface
  • DSLAMs
  • Fault Tolerant Systems
  • ATM equipment with integrated DS1 interfaces
  • ISDN terminal adapter
  • Central office (CO)
  • Digital Modems

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