XRT83VL38IB-F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 225-BGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Published | 2010 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.14V~3.47V |
| Function | Transceiver |
| Number of Circuits | 8 |
XRT83VL38IB-F Overview
Space is saved on the board by using the 225-BGA package.A Tray-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.8 circuits are used in this telecom IC .3.14V~3.47V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.At -40°C~85°C, reliable performance can be achieved.
XRT83VL38IB-F Features
Available in the 225-BGA package
XRT83VL38IB-F Applications
There are a lot of MaxLinear, Inc. XRT83VL38IB-F Telecom applications.
- Integrated Access Devices (IADs)
- T1/E1/J1 Multiplexer and Channel Banks
- PBX (Private Branch Exchange)
- PBX interfaces
- High-Density T1/E1/J1 interfaces for Multiplexers
- Cable Telephony
- Remote wireless modules
- DSLAMs
- High speed data transmission line cards
- Switches