| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2002 |
| Series | XR2 |
| JESD-609 Code | e4 |
| Feature | Open Frame |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, 0.6 (15.24mm) Row Spacing |
| Number of Rows | 2 |
| Contact Finish - Mating | Gold |
| Orientation | Straight |
| Pitch - Mating | 0.100 2.54mm |
| Number of Contacts | 40 |
| Contact Resistance | 20mOhm |
| Max Voltage Rating (AC) | 300V |
| Max Current Rating | 1A |
| Termination Post Length | 0.126 3.20mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 30.0μin 0.76μm |
| Material Flammability Rating | UL94 V-0 |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |