XCZU9CG-2FFVB1156I
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 1156-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of I/O | 328 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.Its package is 1156-BBGA, FCBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC CG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.This SoC security combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells and that is something to note.Housed in the state-of-art Tray package.This SoC part has a total of 328 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9CG-2FFVB1156I System On Chip (SoC) applications.
- ARM Cortex M4 microcontroller
- PC peripherals
- Vending machines
- Measurement tools
- Print Special Issue Flyer
- Communication interfaces ( I2C, SPI )
- Special Issue Editors
- Transmitters
- Central inverter
- Personal Computers