XCZU3EG-2SFVC784E

XCZU3EG-2SFVC784E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3EG-2SFVC784E
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 103
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 252
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Internally, this SoC design uses the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.It comes in a state-of-the-art Tray package.252 I/Os are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

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XCZU3EG-2SFVC784E System On Chip (SoC) applications.

  • Temperature Sensors
  • High-end PLC
  • Industrial robot
  • Central alarm system
  • Test and Measurement
  • Industrial automation devices
  • Automotive gateway
  • Networked sensors
  • Microcontroller
  • ARM processors

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