XCZU17EG-L2FFVE1924E
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 1924-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B1924 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 668 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.Its package is 1924-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 668 I/Os.A power supply with a 0.72V voltage rating should be utilized when using this system on chip SoC.It is unsafe to operate the SoCs wireless at voltages above 0.742V.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.Additionally, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU17EG-L2FFVE1924E System On Chip (SoC) applications.
- Self-aware system-on-chip (SoC)
- RISC-V
- Automotive gateway
- Apple smart watch
- AC drive control module
- External USB hard disk/SSD
- Vending machines
- Smart appliances
- Communication network-on-Chip (cNoC)
- Smart appliances