Parameters |
Factory Lead Time |
10 Weeks |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
48-TFBGA, CSPBGA |
Number of Pins |
48 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Published |
1999 |
JESD-609 Code |
e2 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
48 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
Additional Feature |
IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL |
HTS Code |
8542.32.00.51 |
Subcategory |
Flash Memories |
Technology |
CMOS |
Voltage - Supply |
1.65V~2V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
1.8V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
XCF*P |
Pin Count |
48 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
2V |
Power Supplies |
1.5/3.31.8V |
Supply Voltage-Min (Vsup) |
1.65V |
Programmable Type |
In System Programmable |
Interface |
Parallel, Serial |
Memory Size |
32Mb |
Memory Type |
FLASH, PROM |
Operating Mode |
SYNCHRONOUS |
Supply Current-Max |
0.04mA |
Organization |
32MX1 |
Memory Density |
33554432 bit |
Endurance |
20000 Write/Erase Cycles |
Data Retention Time-Min |
20 |
Height |
860μm |
Length |
9mm |
Width |
8mm |
REACH SVHC |
Unknown |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
XCF32PFSG48C Overview
This package makes use of the 48-TFBGA, CSPBGA programming language.Packaging for the external environment.Qualified to perform a variety of tasks within the -40°C~85°C environment.In System Programmable allows for programmability.The voltage is 1.65V~2V.The memory device is mounted in the Surface Mount position.32Mb is the maximum storage size.Other components related to "XCF*P" can also be found by searching the word.In order for it to function, it requires a voltage supply of 1.8V.With different functions, 48 terminations can be used.With 2V as the maximum voltage, the memory device can be used.1.65V must be the minimum voltage supplied to the device.In reflow soldering, the temperature should be controlled to a maximum of 260 degrees during the process.In this case, it has 48 pins.An operating voltage of 0.04mA is allowed for the memory chip.Parts include 48 pins.The use of a 1.5/3.31.8V power supply is recommended in order to achieve best results.Thus, IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL is included to better serve customers.In other words, a FLASH, PROM memory.A Surface Mount application can be made with it.Memory belongs to the Flash Memories family.
XCF32PFSG48C Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
FLASH, PROM memory
XCF32PFSG48C Applications
There are a lot of Xilinx Inc. XCF32PFSG48C applications of configuration proms for FPGAs.
- personal digital assistants
- mainframes
- Camcorders
- networking
- embedded logic
- Cache memory
- workstations,
- multimedia computers
- eDRAM
- supercomputers