| Parameters |
| Factory Lead Time |
10 Weeks |
| Package / Case |
900-BBGA, FCBGA |
| Supplier Device Package |
900-FCBGA (31x31) |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Tray |
| Published |
2010 |
| Series |
Zynq®-7000 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| Max Operating Temperature |
100°C |
| Min Operating Temperature |
-40°C |
| Frequency |
667MHz |
| Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
130 |
| Speed |
667MHz |
| RAM Size |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Data Bus Width |
32b |
| Core Architecture |
ARM |
| Max Frequency |
667MHz |
| Primary Attributes |
Kintex™-7 FPGA, 444K Logic Cells |
| RoHS Status |
Non-RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Internally, this SoC design uses the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 444K Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 130 I/Os.During operation, the wireless SoC runs at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.The SoC computing will start only if -40°C is set.This SoC system on chip operates at a maximum design temperature of 100°C.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
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