| Parameters |
| Factory Lead Time |
10 Weeks |
| Package / Case |
676-BBGA, FCBGA |
| Surface Mount |
YES |
| Operating Temperature |
0°C~85°C TJ |
| Packaging |
Tray |
| Published |
2010 |
| Series |
Zynq®-7000 |
| JESD-609 Code |
e1 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
| Number of Terminations |
676 |
| ECCN Code |
3A991.D |
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature |
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code |
8542.39.00.01 |
| Technology |
CMOS |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Supply Voltage |
1V |
| Terminal Pitch |
1mm |
| Frequency |
667MHz |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| JESD-30 Code |
S-PBGA-B676 |
| Supply Voltage-Max (Vsup) |
1.05V |
| Supply Voltage-Min (Vsup) |
0.95V |
| Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
130 |
| RAM Size |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Core Architecture |
ARM |
| Boundary Scan |
YES |
| RAM (words) |
256000 |
| Primary Attributes |
Kintex™-7 FPGA, 275K Logic Cells |
| Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) |
3.37mm |
| Length |
27mm |
| Width |
27mm |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.Tray package houses this SoC system on a chip.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.05V.There is a possibility that it can be powered by a power supply of at least 0.95V.In total, there are 676 terminations, which is great for system on a chip.667MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-1FFG676C System On Chip (SoC) applications.
- Servo drive control module
- Fitness
- Efficient hardware for training of neural networks
- Self-aware system-on-chip (SoC)
- Apple smart watch
- Automotive gateway
- Remote control
- RISC-V
- CNC control
- Mouse