XC7Z015-L1CLG485I

XC7Z015-L1CLG485I

485 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z015-L1CLG485I
  • Package: 484-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 298
  • Description: 485 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V(Kg)

Details

Tags

Parameters
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B485
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 120 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 74K Logic Cells
Number of Registers 92400
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 1.6mm
Length 19mm
Width 19mm
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-LFBGA, CSPBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.It has been assigned a package 484-LFBGA, CSPBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.In the Zynq?-7000 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines Artix?-7 FPGA, 74K Logic Cells and that is something to note.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V rating is recommended.Having 485 terminations in total makes system on a chip possible.A frequency of 667MHz is used by the wireless SoC to operate.In this SoC meaning, ARM serves as the core architecture.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.According to its specification, the maximum voltage SoC can handle is 1.05V.As long as it receives at least 950mV of power, then it is working.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z015-L1CLG485I System On Chip (SoC) applications.

  • Smart appliances
  • Vending machines
  • Digital Media
  • USB hard disk enclosure
  • POS Terminals
  • Functional safety for critical applications in the industrial sectors
  • Networked sensors
  • ARM support modules
  • ARM processors
  • Optical drive

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