| Parameters |
| Factory Lead Time |
10 Weeks |
| Package / Case |
484-LFBGA, CSPBGA |
| Supplier Device Package |
484-CSPBGA (19x19) |
| Operating Temperature |
-40°C~100°C TJ |
| Packaging |
Bulk |
| Published |
2010 |
| Series |
Zynq®-7000 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
2A (4 Weeks) |
| Number of I/O |
130 |
| Speed |
766MHz |
| RAM Size |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Primary Attributes |
Artix™-7 FPGA, 74K Logic Cells |
| RoHS Status |
Non-RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.It has been assigned a package 484-LFBGA, CSPBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Zynq?-7000 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Artix?-7 FPGA, 74K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 130 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XC7Z015-2CL485I System On Chip (SoC) applications.
- Smart appliances
- Published Paper
- Industrial sectors
- Sports
- Smart appliances
- Mobile market
- CNC control
- Healthcare
- Remote control
- POS Terminals