| Parameters |
| Factory Lead Time |
10 Weeks |
| Package / Case |
225-LFBGA, CSPBGA |
| Surface Mount |
YES |
| Number of Pins |
225 |
| Operating Temperature |
0°C~100°C TJ |
| Packaging |
Tray |
| Published |
2010 |
| Series |
Zynq®-7000 |
| JESD-609 Code |
e1 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
225 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code |
8542.39.00.01 |
| Technology |
CMOS |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
260 |
| Supply Voltage |
1V |
| Terminal Pitch |
0.8mm |
| Frequency |
866MHz |
| Time@Peak Reflow Temperature-Max (s) |
30 |
| Base Part Number |
XC7Z010 |
| Supply Voltage-Max (Vsup) |
1.05V |
| Supply Voltage-Min (Vsup) |
0.95V |
| Interface |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
86 |
| RAM Size |
256KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Data Bus Width |
32b |
| Core Architecture |
ARM |
| Boundary Scan |
YES |
| Speed Grade |
-3 |
| RAM (words) |
256000 |
| Primary Attributes |
Artix™-7 FPGA, 28K Logic Cells |
| Bus Compatibility |
CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) |
1.5mm |
| Length |
13mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 225-LFBGA, CSPBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.In addition, this SoC security combines Artix?-7 FPGA, 28K Logic Cells.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of 86 I/Os in total.Use a power supply with a voltage of 1V if possible.There is no safe voltage for the SoCs wireless above 1.05V.Power supplies of at least 0.95V are required.Having 225 terminations in total makes system on a chip possible.A search for XC7Z010 will result in system on chips that have similar specs and purposes.During operation, the wireless SoC runs at a frequency of 866MHz.Core architecture of ARM underpins the SoC meaning.The computer SoC has 225 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-3CLG225E System On Chip (SoC) applications.
- Samsung galaxy gear
- Three phase UPS
- Published Paper
- AC-input BLDC motor drive
- Industrial AC-DC
- Central alarm system
- DC-input BLDC motor drive
- Optical drive
- Special Issue Information
- Temperature