XC3S250E-4FTG256C
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | Spartan®-3E |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Frequency | 572MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC3S250E |
| Pin Count | 256 |
| Number of Outputs | 132 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.32.5V |
| Number of I/O | 172 |
| RAM Size | 27kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 5508 |
| Total RAM Bits | 221184 |
| Number of Gates | 250000 |
| Number of LABs/CLBs | 612 |
| Speed Grade | 4 |
| Number of Registers | 4896 |
| Combinatorial Delay of a CLB-Max | 0.76 ns |
| Number of CLBs | 612 |
| Height | 1mm |
| Length | 17mm |
| Width | 17mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
XC3S250E-4FTG256C Overview
There is a 256-LBGA package that includes this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 5508 logic elements or cells. Power is provided by a 1.2V-volt supply. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. There are many types of FPGAs in the Spartan?-3E series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. In order to make this device as versatile as possible, there are 132 different outputs included. As a space-saving measure, this FPGA model is contained within Tray. There are a total of 256 terminations. A device like this one offers 221184 RAM bits, which is a considerable amount of memory. Its base part number XC3S250E can be used to find related parts. For the program to work properly, the RAM si27kBe of this FPGA module must reach 27kB GB in order to ensure normal operation. In this case, 256 pins are used in the design. Fpga electronics contains 612 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Power is supplied to the device by a 1.21.2/3.32.5V battery. There are 250000 gates in its basic building block. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. The data is stored and transferred using 4896 registers that are used for this purpose. CLBs are the building blocks of its architecture. With a frequency of 572MHz, it delivers high efficiency.
XC3S250E-4FTG256C Features
172 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
4896 registers
Operating from a frequency of 572MHz
XC3S250E-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S250E-4FTG256C FPGAs applications.
- Automotive advanced driver assistance systems (ADAS)
- Data center search engines
- Device controllers
- DO-254
- Digital signal processing
- ASIC prototyping
- Consumer Electronics
- Image processing
- ADAS
- Industrial IoT