XC2S200E-6FG456C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 456-BBGA |
| Number of Pins | 456 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | Spartan®-IIE |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 456 |
| ECCN Code | 3A991.D |
| Additional Feature | MAXIMUM USABLE GATES = 150000 |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~1.89V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC2S200E |
| Pin Count | 456 |
| Number of Outputs | 289 |
| Operating Supply Voltage | 1.8V |
| Number of I/O | 289 |
| RAM Size | 7kB |
| Clock Frequency | 357MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of Gates | 200000 |
| Number of LABs/CLBs | 1176 |
| Speed Grade | 6 |
| Combinatorial Delay of a CLB-Max | 0.47 ns |
| Number of CLBs | 864 |
| Number of Equivalent Gates | 52000 |
| Length | 23mm |
| Width | 23mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC2S200E-6FG456C Overview
In the 456-BBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 289 I/Os for better data transfer. A fundamental building block is made up of 5292 logic elements/cells. Fpga chips is powered from a supply voltage of 1.8V. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Spartan?-IIE series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. A device such as this one has 289 outputs built into it. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is designed wFpga chipsh 456 terminations. Having a RAM bit size of 57344 means that this device will offer you a lot of memory. For related parts, use its base part number XC2S200E. The RAM si7kBe of this FPGA module reaches 7kB so as to guarantee the normal operation of the program during operation. Fpga electronics is designed wfpga electronics h 456 pins. The FPGA consists of 1176 LABs/CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. A 1.8V-volt supply allows designers to fully utilize its flexibility. As a basic building block, fpga semiconductor consists of 200000 gates. Featuring 456 pins in total, it is a versatile device. Most of the time, it uses a crystal oscillating at 357MHz to generate the signal. 864 CLBs are basic modules used for its architecture. Additionally, this feature is also known as MAXIMUM USABLE GATES = 150000, which is one of its main characteristics. There are 52000 equivalent gates implemented by the FPGA in order to implement the design.
XC2S200E-6FG456C Features
289 I/Os
Up to 57344 RAM bits
456 LABs/CLBs
XC2S200E-6FG456C Applications
There are a lot of Xilinx Inc. XC2S200E-6FG456C FPGAs applications.
- ADAS
- Industrial Ethernet
- Image processing
- Solar Energy
- Military DSP
- Consumer Electronics
- Random logic
- ASIC prototyping
- Electronic Warfare
- Medical ultrasounds