| Parameters |
| Factory Lead Time |
10 Weeks |
| Mounting Type |
Surface Mount |
| Package / Case |
20-LCC (J-Lead) |
| Surface Mount |
YES |
| Number of Pins |
20 |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Published |
1999 |
| JESD-609 Code |
e3 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
20 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Matte Tin (Sn) |
| Subcategory |
Flash Memories |
| Technology |
CMOS |
| Voltage - Supply |
3V~3.6V |
| Terminal Position |
QUAD |
| Terminal Form |
J BEND |
| Peak Reflow Temperature (Cel) |
245 |
| Number of Functions |
1 |
| Supply Voltage |
3.3V |
| Terminal Pitch |
1.27mm |
| Time@Peak Reflow Temperature-Max (s) |
30 |
| Base Part Number |
XC18V512 |
| Pin Count |
20 |
| Operating Supply Voltage |
3.3V |
| Supply Voltage-Max (Vsup) |
3.6V |
| Supply Voltage-Min (Vsup) |
3V |
| Programmable Type |
In System Programmable |
| Clock Frequency |
33MHz |
| Supply Current-Max |
0.025mA |
| Organization |
64KX8 |
| Memory Width |
8 |
| Density |
512 kb |
| Standby Current-Max |
0.01A |
| Access Time (Max) |
15 ns |
| Parallel/Serial |
PARALLEL/SERIAL |
| Memory IC Type |
CONFIGURATION MEMORY |
| Data Retention Time-Min |
20 |
| Height Seated (Max) |
4.572mm |
| Length |
8.9662mm |
| Width |
8.9662mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
XC18V512PCG20C Overview
An interesting 20-LCC (J-Lead) package is used.External packaging of type Tray.In the state of 0°C~70°C, licensed to work.With the help of In System Programmable, it can be programmed.With a voltage of 3V~3.6V, it is powered.There is a memory device mounted in Surface Mount position for this device.Other components related to "XC18V512" can also be found by searching the word.3.3V is the voltage it requires as a supply.20 terminations with different functions.This memory device can be used with a maximum voltage of 3.6V.It is necessary to supply the device with a minimum voltage of 3V.An CONFIGURATION MEMORY memory chip.Reflow soldering should be done at 245°C maximum.20 pins are located on the board.In this memory, data is transmitted using the PARALLEL/SERIAL process.The memory chip is allowed to operate at a voltage that is no greater than 0.025mA.The part comes with a set of 20 pins.Speaking of speed, this is a memory IC that can work at a 33MHz frequency.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.More specifically, it's a kind of Flash Memories.
XC18V512PCG20C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V512PCG20C Applications
There are a lot of Xilinx Inc. XC18V512PCG20C applications of configuration proms for FPGAs.
- eDRAM
- printers
- DVD disk buffer
- hard disk drive (HDD)
- data buffer
- networking
- multimedia computers
- cell phones
- networks
- embedded logic