XC17S50ASO20C

XC17S50ASO20C

Surface Mount 500kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S50A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S50ASO20C
  • Package: 20-SOIC (0.295, 7.50mm Width)
  • Datasheet: PDF
  • Stock: 842
  • Description: Surface Mount 500kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S50A (Kg)

Details

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Parameters
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Number of Pins 20
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
HTS Code 8542.32.00.71
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S50A
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 500kb
Supply Current-Max 0.015mA
Output Characteristics 3-STATE
Memory Width 1
Density 1 Mb
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 2.65mm
Length 12.8mm
Width 7.5mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S50ASO20C Overview


An interesting 20-SOIC (0.295, 7.50mm Width) package is used for this.Packaging for the external environment.A qualified individual to operate within 0°C~70°C is required.This device can be programmed using OTP.A voltage of 3V~3.6V is applied to it in order to power it.This memory device is mounted in Surface Mount.There is a limit to the size of data storage of 500kb bytes.You can search "XC17S50A" for other related parts.FPGA reuqires a supply voltage of 3.3V.Various functions can be applied to 20 terminations.Using this memory device with a maximum voltage of 3.6V is possible.It is necessary to supply the device with a minimum voltage of 3V.A CONFIGURATION MEMORY memory chip like this is used for data storage.In reflow soldering procedure, the temperature should be controlled to no higher than 225.Pins on it are 20-shaped.As a result of the SERIAL process, data is transmitted from this memory.The memory chip is allowed to operate at a voltage that is no greater than 0.015mA.With the part are included 20 pins.The memory's I/O is configured to be COMMON in terms of its configuration.The 3.3V company recommends that users apply 3.3V to the part before using it in a circuit so that it can run safely and reliably in the circuit.

XC17S50ASO20C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S50ASO20C Applications


There are a lot of Xilinx Inc. XC17S50ASO20C applications of configuration proms for FPGAs.

  • graphics card
  • supercomputers
  • personal digital assistants
  • eSRAM
  • main computer memory
  • telecommunications
  • multimedia computers
  • DVD disk buffer
  • networking
  • Cache memory

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