XC17S200APD8I
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17S200A |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 2Mb |
| Supply Current-Max | 0.015mA |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Standby Current-Max | 0.001A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17S200APD8I Overview
A neat 8-DIP (0.300, 7.62mm) package is used.External packaging for the Tube series.Licensed to operate in -40°C~85°C.With the help of OTP, it can be programmed.This device is fed with a voltage of 3V~3.6V which is applied to it.Mounted in Through Hole is this memory device.Data storage is limited to a size of 2Mb bytes.Search "XC17S200A" for related parts.Supply voltage 3.3V is required.Various functions can be applied to 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.There are 8 pins on it.Through SERIAL-processing, data is transmitted from this memory to the CPU.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.
XC17S200APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APD8I Applications
There are a lot of Xilinx Inc. XC17S200APD8I applications of configuration proms for FPGAs.
- cell phones
- telecommunications
- personal computers
- multimedia computers
- data buffer
- eSRAM
- mainframes
- personal digital assistants
- networking
- DVD disk buffer