XC17S15APD8I

XC17S15APD8I

Through Hole 150kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S15A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S15APD8I
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 584
  • Description: Through Hole 150kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S15A (Kg)

Details

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Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature -40°C~85°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S15A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 150kb
Supply Current-Max 0.005mA
Organization 197696X1
Output Characteristics 3-STATE
Memory Width 1
Density 512 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S15APD8I Overview


FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.Packaging for the external use of Tube.A qualified individual who has the ability to operate within -40°C~85°C.With the help of OTP, it can be programmed.FPGA is fed wFPGAh a voltage of 3V~3.6V.Through Hole is the mounting position of this memory device.A data storage size of 150kb is allowed.Other related parts can be found by searching "XC17S15A".The supply voltage of the device must be 3.3V in order to operate correctly.Different functions are associated with 8 terminations.In order to use this memory device, a maximum voltage of 3.6V should be used.3V must be the minimum voltage supplied to the device.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.In reflow soldering procedure, the temperature should be controlled to no higher than 225.The 8 pins are on the board.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.005mA.8 pins are set with the part.There is a configuration of COMMON for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.

XC17S15APD8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S15APD8I Applications


There are a lot of Xilinx Inc. XC17S15APD8I applications of configuration proms for FPGAs.

  • hard disk drive (HDD)
  • data buffer
  • personal computers
  • eSRAM
  • main computer memory
  • nonvolatile BIOS memory
  • Camcorders
  • servers
  • DVD disk buffer
  • workstations,

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