XC17S10XLVO8C

XC17S10XLVO8C

Surface Mount 100kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S10XL not_compliant


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S10XLVO8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 913
  • Description: Surface Mount 100kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S10XL not_compliant (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S10XL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 100kb
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Organization 95752X1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Memory Density 95752 bit
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 1.2mm
Length 4.9mm
Width 3.9mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S10XLVO8C Overview


There is a neat 8-SOIC (0.154, 3.90mm Width) package that is used in this program.External packaging of type Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.With the help of OTP, it can be programmed.There is a voltage of 3V~3.6V applied to the device.This memory device is mounted in Surface Mount.100kb is the maximum storage size.Other related parts can be found by searching "XC17S10XL".The supply voltage of the device must be 3.3V in order to operate correctly.Different types of 8 terminations are available with different functions.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.An operating voltage of 3V is required in order to supply the device.FPGA is a MEMORY CIRCUIT memory chip that we are talking about here.Reflow soldering should be done at no higher than 225 degrees.Pins on it are 8-shaped.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts come with 8 pins set.There is a memory IC in this package that works at 10MHz frequencies.There is a configuration of COMMON for the memory's I/O.Using a 3.3V power supply is recommended for best results.

XC17S10XLVO8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S10XLVO8C Applications


There are a lot of Xilinx Inc. XC17S10XLVO8C applications of configuration proms for FPGAs.

  • DVD disk buffer
  • workstations,
  • main computer memory
  • eDRAM
  • supercomputers
  • data buffer
  • printers
  • telecommunications
  • hard disk drive (HDD)
  • embedded logic

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