XC17256ELPD8C
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Number of Pins | 8 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 2000 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Technology | CMOS |
| Voltage - Supply | 3V~3.6V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 2.54mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC17256EL |
| Pin Count | 8 |
| Operating Supply Voltage | 3.3V |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Programmable Type | OTP |
| Memory Size | 256Kb |
| Clock Frequency | 15MHz |
| Supply Current-Max | 0.005mA |
| Organization | 256KX1 |
| Output Characteristics | 3-STATE |
| Memory Width | 1 |
| Density | 256 kb |
| Standby Current-Max | 0.00005A |
| Parallel/Serial | SERIAL |
| I/O Type | COMMON |
| Memory IC Type | CONFIGURATION MEMORY |
| Height Seated (Max) | 4.5974mm |
| Length | 9.3599mm |
| Width | 7.62mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XC17256ELPD8C Overview
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.OTP allows for programmability.There is a voltage of 3V~3.6V applied to the device.Through Hole is the orientation of this memory device.There is a limit to the size of data storage of 256Kb bytes.Other related parts can be found by searching "XC17256EL".Supply voltage 3.3V is required.Different types of 8 terminations are available with different functions.A maximum voltage of 3.6V can be applied to this memory device.It is necessary to supply the device with a minimum voltage of 3V.A CONFIGURATION MEMORY memory chip is shown here.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.In order for a memory chip to function properly, it must be subjected to a voltage of not more than 0.005mA.Parts come with 8 pins set.Using a 15MHz frequency, this memory IC can work at high speeds.There is a COMMON configuration for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.For better customer service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is added.
XC17256ELPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256ELPD8C Applications
There are a lot of Xilinx Inc. XC17256ELPD8C applications of configuration proms for FPGAs.
- nonvolatile BIOS memory
- multimedia computers
- servers
- eSRAM
- networks
- workstations,
- networking
- graphics card
- main computer memory
- embedded logic