XAZU3EG-L1SFVC784I
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 784-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 784 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B784 |
| Number of I/O | 128 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 1.8MB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| Architecture | MPU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Height Seated (Max) | 3.32mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.This system on a chip is packaged as 784-BFBGA, FCBGA by the manufacturer.A SoC chip with 1.8MB RAM is provided for users to enjoy reliable performance.A MPU, FPGA technique is used for the SoC design's internal architecture.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 128 I/Os.A 0.72V power supply should be used.In total, there are 784 terminations, which makes system on a chip possible.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU3EG-L1SFVC784I System On Chip (SoC) applications.
- Mobile market
- Networked sensors
- PC peripherals
- Temperature Sensors
- High-end PLC
- Video Imaging
- Automotive
- AC drive control module
- Industrial automation devices
- Mouse