XAZU2EG-L1SFVA625I

XAZU2EG-L1SFVA625I

625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XAZU2EG-L1SFVA625I
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 324
  • Description: 625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V (Kg)

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 625
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B625
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Height Seated (Max) 3.43mm
Length 21mm
Width 21mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package as per the manufacturer's specifications.A 1.2MB RAM SoC chip provides reliable performance to users.Using the MPU, FPGA technique, this SoC design's internal architecture is simple.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 128 I/Os.It is advised to utilize a 0.72V power supply.In total, there are 625 terminations, which is great for system on a chip.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XAZU2EG-L1SFVA625I System On Chip (SoC) applications.

  • Medical
  • Self-aware system-on-chip (SoC)
  • Body control module
  • Keywords
  • ARM processors
  • RISC-V
  • Efficient hardware for inference of neural networks
  • Published Paper
  • Wireless sensor networks
  • Medical

Write a review

Note: HTML is not translated!
    Bad           Good