| Parameters |
| Factory Lead Time |
10 Weeks |
| Contact Plating |
Copper, Silver, Tin |
| Mount |
Surface Mount |
| Package / Case |
400-LFBGA, CSPBGA |
| Number of Pins |
400 |
| Operating Temperature |
-40°C~125°C TJ |
| Packaging |
Tray |
| Published |
2010 |
| Series |
Automotive, AEC-Q100, Zynq®-7000 XA |
| JESD-609 Code |
e1 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
400 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code |
8542.39.00.01 |
| Subcategory |
Other uPs/uCs/Peripheral ICs |
| Technology |
CMOS |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Terminal Pitch |
0.8mm |
| Frequency |
667MHz |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Qualification Status |
Not Qualified |
| Operating Supply Voltage |
1V |
| Power Supplies |
11.8V |
| Interface |
CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O |
130 |
| RAM Size |
256KB |
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA |
| Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Data Bus Width |
32b |
| Core Architecture |
ARM |
| Primary Attributes |
Artix™-7 FPGA, 85K Logic Cells |
| UV Erasable |
N |
| Height Seated (Max) |
1.6mm |
| Length |
17mm |
| RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Automotive, AEC-Q100, Zynq?-7000 XA series.Temperatures should be -40°C~125°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 85K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 130 I/Os in total.The system on a chip uses 400 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Other uPs/uCs/Peripheral ICs.As far as power supplies are concerned, system on chip requires 11.8V.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.Currently, the computer SoC is available in a 400-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z020-1CLG400Q System On Chip (SoC) applications.
- Vending machines
- Smartphones
- Transmitters
- Temperature Sensors
- Industrial sectors
- Industrial transport
- Sports
- Video Imaging
- Published Paper
- Body control module