XA7Z010-1CLG225Q
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 225-LFBGA, CSPBGA |
| Number of Pins | 225 |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Automotive, AEC-Q100, Zynq®-7000 XA |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 225 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other uPs/uCs/Peripheral ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Terminal Pitch | 0.8mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1V |
| Power Supplies | 11.8V |
| Interface | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 86 |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
| UV Erasable | N |
| Height Seated (Max) | 1.5mm |
| Length | 13mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.According to the manufacturer, this system on a chip has a package of 225-LFBGA, CSPBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the Automotive, AEC-Q100, Zynq?-7000 XA series.The average operating temps for this SoC meaning should be -40°C~125°C TJ.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 28K Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 86 I/Os.The system on a chip uses 225 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.You will need to provide 11.8V power supplies in order to run system on chip.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC is the 225-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z010-1CLG225Q System On Chip (SoC) applications.
- Industrial transport
- POS Terminals
- Body control module
- Keyboard
- Special Issue Information
- Optical drive
- High-end PLC
- DC-input BLDC motor drive
- Medical Pressure
- Functional safety for critical applications in the industrial sectors