WS-3270-KD-2400

WS-3270-KD-2400

WS-3270-KD-2400 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from 3G Shielding Specialties LP stock available at ORIGCHIP


  • Manufacturer: 3G Shielding Specialties LP
  • Origchip NO: 1-WS-3270-KD-2400
  • Package: -
  • Datasheet: -
  • Stock: 634
  • Description: WS-3270-KD-2400 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from 3G Shielding Specialties LP stock available at ORIGCHIP(Kg)

Details

Tags

Parameters
Material Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
Shape D-Shape
Operating Temperature -40°C~71°C
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Fabric Over Foam
Attachment Method Adhesive
Height 0.375 9.53mm
Length 24.000 609.60mm
Width 0.500 12.70mm
RoHS Status ROHS3 Compliant

WS-3270-KD-2400 Overview


Materials from Polyurethane Foam, Nickel-Copper Polyester (NI/CU) are used in Contact RFI packaging.-40°C~71°C is the operating temperature and EMI/RFI works fine.The contacter RFI has type Fabric Over Foam.

WS-3270-KD-2400 Features


Fabric Over Foam

WS-3270-KD-2400 Applications


There are a lot of 3G Shielding Specialties LP WS-3270-KD-2400 RFI and EMI Contacts applications.

  • Industrial Logger
  • Secure Payment
  • Smart Energy
  • Utility Energy
  • Switch
  • Internet of Things
  • Power Amplifier
  • Digital Remote
  • Home and Security

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