WM7331IMSE/RV
| Parameters | |
|---|---|
| Mount | Solder Pad |
| Shape | Rectangular |
| Packaging | Cut Tape (CT) |
| Published | 2016 |
| Size / Dimension | 0.098Lx0.063W 2.50mmx1.60mm |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 2A (4 Weeks) |
| Number of Terminations | 4 |
| Termination | Solder Pads |
| ECCN Code | EAR99 |
| Type | MEMS (Silicon) |
| Voltage - Rated | 1.8V |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Form | BUTT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Depth | 1.6mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XBGA-B4 |
| Operating Temperature (Max) | 100°C |
| Operating Temperature (Min) | -40°C |
| Output Type | Analog |
| Temperature Grade | INDUSTRIAL |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 1.6V |
| Operating Supply Current | 60μA |
| Direction | Omnidirectional |
| Voltage Range | 1.6V~3.6V |
| Frequency Range | 70Hz~15kHz |
| Sensitivity | -38dB ±1dB @ 94dB SPL |
| Port Location | Bottom |
| S/N Ratio | 63dB |
| Height | 900μm |
| Length | 2.5mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet