VSC8572XKS-05
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-PBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V 2.5V |
| Function | Ethernet |
| Interface | RMII |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
VSC8572XKS-05 Overview
The 256-BGA package reduces the amount of space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.Telecommunications equipment consists of 2 circuits.When 1V 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.
VSC8572XKS-05 Features
Available in the 256-BGA package
VSC8572XKS-05 Applications
There are a lot of Microchip Technology VSC8572XKS-05 Telecom applications.
- Inverse Multiplexing for ATM (IMA)
- PDH Multiplexers
- Digital Cross-Connect Systems
- Digital access cross connects
- SDH/SONET multiplexers
- Switching Systems
- ISDN terminal adapter
- Digital cross connects (DSX-1)
- M13 MUX
- Fractional T1/E1/J1