VSC8541XMV-01
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 68-VFQFN Exposed Pad |
| Supplier Device Package | 68-QFN (8x8) |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2009 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Ethernet |
| Interface | RMII |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8541XMV-01 Overview
The 68-VFQFN Exposed Pad package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .Operating temperatures of -40°C~125°C can ensure reliable performance.
VSC8541XMV-01 Features
Available in the 68-VFQFN Exposed Pad package
VSC8541XMV-01 Applications
There are a lot of Microchip Technology VSC8541XMV-01 Telecom applications.
- Home Side Box
- T1/E1/J1 Performance Monitoring
- Integrated Multi-Service Access Platforms (IMAPs)
- Network Multiplexing and Terminating Equipment
- Channel Banks
- Digital Cross-Connect Systems
- SONET/SDH terminal
- E2 Rates PCM Line Interface
- E3/DS3 Access Equipment
- DECT (Digital European Cordless Telephone) Base