VSC7113XJW
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 32-TFQFN Exposed Pad |
| Supplier Device Package | 32-QFN (5x5) |
| Operating Temperature | -40°C~110°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.5V |
| Function | Signal Conditioner |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
VSC7113XJW Overview
In order to save space on the board, the 32-TFQFN Exposed Pad package is used.For telecommunications equipment packing, the Tray method is used.Telecommunications equipment is mounted using Surface Mount.2 circuits are used in this telecom IC .When 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.The operating temperature set at -40°C~110°C can offer reliable performance.
VSC7113XJW Features
Available in the 32-TFQFN Exposed Pad package
VSC7113XJW Applications
There are a lot of Microchip Technology VSC7113XJW Telecom applications.
- Cable PC
- Codec function on telephone switch line cards
- Stations
- Digital Cross-connect Systems (DCS)
- Digital cross connects (DSX-1)
- ISDN Primary Rate Interface
- Remote wireless modules
- T1 Digital Cross Connects (DSX-1)
- Home Side Box
- Integrated Access Devices (IADs)