VSC7112XJW
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 32-TFQFN Exposed Pad |
| Supplier Device Package | 32-QFN (5x5) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.5V |
| Function | Signal Conditioner |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
VSC7112XJW Overview
A 32-TFQFN Exposed Pad package saves space on a board.Telecommunications equipment is packed according to Tray's method.Surface Mount is used as telecommunications equipment mounting type.2 circuits make up this telecom IC .2.5V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.
VSC7112XJW Features
Available in the 32-TFQFN Exposed Pad package
VSC7112XJW Applications
There are a lot of Microchip Technology VSC7112XJW Telecom applications.
- E1 Network Equipment
- T1 Digital Cross Connects (DSX-1)
- T1/E1/J1 add/drop multiplexers (MUX)
- T3 channelized access concentrators
- Wireless base stations
- CSU/DSU E1 Interface
- Router
- Digital Cross-Connect Systems
- Hybrid fiber coax (HFC)
- Voice over IP/DSL