UJA1169LTK/XZ
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 20-VFDFN Exposed Pad |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | System Basis Chip |
| Voltage - Supply | 5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Interface | CAN |
| RoHS Status | ROHS3 Compliant |
UJA1169LTK/XZ Overview
20-VFDFN Exposed Padis an appropriate package for this device.It comes in a case with a [0].In this case, this component is installed in accordance with Surface Mount.System Basis Chipapplies to this component.The device is capable of supplying voltages of 5V volts.
UJA1169LTK/XZ Features
UJA1169LTK/XZ Applications
There are a lot of NXP USA Inc. UJA1169LTK/XZ Specialized Interface ICs applications.
- Audio signal routing
- Signal routing between systems
- Battery Powered Systems
- E1 Network Equipment
- DSLAMs
- PCMCIA cards
- Channel Banks
- SONET/SDH ADM
- Isolation
- Cross Connects