Parameters |
Factory Lead Time |
14 Weeks |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.433, 11.00mm Width) Exposed Pad |
Operating Temperature |
-40°C~85°C |
Packaging |
Tape & Reel (TR) |
Published |
2003 |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Ignition Buffer, Regulator |
Voltage - Supply |
9.5V~18V |
Base Part Number |
TDA3681 |
Current - Supply |
110μA |
RoHS Status |
ROHS3 Compliant |
TDA3681TH/N2S,518 Overview
Ready for shipping the power management in Tape & Reel (TR) package.Packing in 20-SOIC (0.433, 11.00mm Width) Exposed Pad makes transportation convenient.The Surface Mount mounting method allows for easy adaptation.It is intended to be used at Ignition Buffer, Regulator as well as for other applications.Ensure that the operating temperature of the power management ic is set to -40°C~85°C in order to prevent malfunctions.This power management uses 9.5V~18V voltage for work.Search TDA3681 to find more power ic's pin-to-pin solutions.A supply current of 110μA should be applied to the power ic.
TDA3681TH/N2S,518 Features
Mainly used in Ignition Buffer, Regulator applications
Operating temperature: -40°C~85°C
TDA3681TH/N2S,518 Applications
There are a lot of NXP USA Inc. TDA3681TH/N2S,518Power Management applications.
- HSTL Termination
- SSTL-3 Termination
- Space satellite point of load supply
- Desktop PC
- Base Station Power Distribution Systems
- LTE modem
- Field Service
- SSTL-2 WHITE SPACE
- FPGA
- Wireless routers