TC1-200G

TC1-200G

HEAT SINK COMPOUND - HIGH DENSIT


  • Manufacturer: Chip Quik Inc.
  • Origchip NO: 138-TC1-200G
  • Package: -
  • Datasheet: PDF
  • Stock: 404
  • Description: HEAT SINK COMPOUND - HIGH DENSIT (Kg)

Details

Tags

Parameters
Factory Lead Time 4 Weeks
Size / Dimension 200 gram Jar
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Silicone Compound
Color White
Shelf Life 60 Months
Storage/Refrigeration Temperature 37°F~77°F 3°C~25°C
Shelf Life Start Date of Manufacture
Thermal Conductivity 0.67W/m-K
RoHS Status ROHS3 Compliant
See Relate Datesheet

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