| Parameters | |
|---|---|
| Mounting Type | Chassis Mount |
| Surface Mount | NO |
| Diode Element Material | SILICON |
| Series | SMT |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 1 |
| ECCN Code | EAR99 |
| Type | Laminated Core |
| HTS Code | 8541.10.00.50 |
| Technology | ZENER |
| Terminal Form | UNSPECIFIED |
| Pin Count | 1 |
| Termination Style | Solder, Quick Connect |
| JESD-30 Code | O-MUPM-X1 |
| Number of Elements | 1 |
| Polarity | UNIDIRECTIONAL |
| Power Dissipation-Max | 5W |
| Case Connection | ISOLATED |
| Power - Max | 1000VA |
| Rep Pk Reverse Voltage-Max | 7.5V |
| Non-rep Peak Rev Power Dis-Max | 1000W |
| Primary Winding(s) | Dual |
| Center Tap | No |
| Breakdown Voltage-Min | 8.19V |
| Secondary Winding(s) | Single |
| Breakdown Voltage-Max | 10.01V |
| Height Seated (Max) | 143.00mm |
| RoHS Status | RoHS Compliant |