SST12LF09-Q3CE

SST12LF09-Q3CE

2.4GHz 802.11ac Front End Module integrating PA Switch and LNA with bypass


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-SST12LF09-Q3CE
  • Package: 16-XFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 674
  • Description: 2.4GHz 802.11ac Front End Module integrating PA Switch and LNA with bypass (Kg)

Details

Tags

Parameters
Factory Lead Time 19 Weeks
Package / Case 16-XFQFN Exposed Pad
Surface Mount YES
Number of Pins 16
Packaging Tape & Reel (TR)
Published 2013
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
Terminal Finish MATTE TIN
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.6V
Terminal Pitch 0.5mm
Frequency 2.4GHz
Time@Peak Reflow Temperature-Max (s) 40
Operating Supply Voltage 3.6V
Temperature Grade INDUSTRIAL
Operating Supply Current 170mA
Data Rate 54 Mbps
Bandwidth 40MHz
Telecom IC Type TELECOM CIRCUIT
RF Type WLAN
Height Seated (Max) 0.4mm
Length 2.5mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good