SOMDIMM-LPC3250

SOMDIMM-LPC3250

MODULE DIMM LPC3250 ARM9


  • Manufacturer: Future Designs Inc.
  • Origchip NO: 308-SOMDIMM-LPC3250
  • Package: Module
  • Datasheet: PDF
  • Stock: 560
  • Description: MODULE DIMM LPC3250 ARM9 (Kg)

Details

Tags

Parameters
Mounting Type Fixed
Package / Case Module
Published 2009
Series LPC3200
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type MCU 32-Bit
Core Processor ARM9
Utilized IC / Part LPC3250
Evaluation Kit Yes
Core Architecture ARM
Contents Board(s)
Board Type Evaluation Platform
Operating System Linux
RoHS Status RoHS Compliant
See Relate Datesheet

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