SMDLTLFP250T3
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Weight | 0.551lb 249.93g |
| Packaging | Jar |
| Published | 2015 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Solder Paste |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Shelf Life | 6 Months, 2 Months |
| Storage/Refrigeration Temperature | 37°F~46°F 3°C~8°C |
| Shelf Life Start | Date of Manufacture |
| Form | Jar, 8.8 oz (250g) |
| Process | Lead Free |
| Melting Point | 281°F 138°C |
| Flux Type | No-Clean |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet