| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Published | 2013 |
| Series | SMD2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Solder Sphere |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Form | Jar |
| Process | Lead Free |
| Melting Point | 423°F~428°F 217°C~220°C |
| Diameter | 0.024 0.61mm |
| RoHS Status | ROHS3 Compliant |