SLE66R35RMCC8IXHSA1
| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Supplier Device Package | Wafer |
| Operating Temperature | -25°C~70°C |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | Security |
| Interface | ISO14443-3 Type A |
| RoHS Status | ROHS3 Compliant |
SLE66R35RMCC8IXHSA1 Overview
In light of its outstanding performance, it is an ideal choice for Security.There is a Die package available to save space.Surface Mount is used for mounting.Tape & Reel (TR) is the package that contains it.In order to work effectively, the temperature should be kept at -25°C~70°C.
SLE66R35RMCC8IXHSA1 Features
Die package
Mounting type of Surface Mount
SLE66R35RMCC8IXHSA1 Applications
There are a lot of Infineon Technologies SLE66R35RMCC8IXHSA1 Microcontroller applications.
- Smart instruments
- Blenders
- Vacuum cleaners
- Data acquisition and control
- Entertainment-radios, CD players, televisions
- PDAs, game consoles
- DDC control
- Xbox
- Industrial instrumentation devices
- Glucose monitoring systems (for Type 1 Diabetes)