 
    | Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks | 
| Mount | Surface Mount | 
| Mounting Type | Surface Mount | 
| Package / Case | 20-SMD Module | 
| Number of Pins | 20 | 
| Weight | 123.008581mg | 
| Packaging | Tape & Reel (TR) | 
| Published | 2009 | 
| JESD-609 Code | e4 | 
| Pbfree Code | yes | 
| Part Status | Obsolete | 
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 
| Number of Terminations | 20 | 
| Terminal Finish | GOLD OVER NICKEL | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -40°C | 
| Max Power Dissipation | 3.3W | 
| Technology | BIPOLAR | 
| Terminal Position | QUAD | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 5V | 
| Frequency | 2.4GHz~2.5GHz | 
| Time@Peak Reflow Temperature-Max (s) | 40 | 
| Pin Count | 20 | 
| Operating Supply Voltage | 5V | 
| Temperature Grade | INDUSTRIAL | 
| Number of Channels | 1 | 
| Test Frequency | 2.4GHz | 
| Operating Supply Current | 490mA | 
| Power Dissipation | 3.3W | 
| Gain | 32dB | 
| Telecom IC Type | WIRELESS LAN CIRCUIT | 
| RF Type | WLAN | 
| Length | 6mm | 
| Width | 6mm | 
| Radiation Hardening | No | 
| RoHS Status | ROHS3 Compliant |