SBB0802P-1

SBB0802P-1

SOLDER-IN BREADBOARD 1X1" (8 ROW


  • Manufacturer: Chip Quik Inc.
  • Origchip NO: 138-SBB0802P-1
  • Package: -
  • Datasheet: -
  • Stock: 897
  • Description: SOLDER-IN BREADBOARD 1X1" (8 ROW (Kg)

Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 1.00Lx1.00W 25.4mmx25.4mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Pitch 0.1 2.54mm Grid
Plating Plated Through Hole (PTH)
Hole Diameter 0.039 (1.00mm)
Proto Board Type Breadboard, General Purpose
Circuit Pattern Pad Per Hole (Round)
Board Thickness 0.063 1.60mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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