R8A77610DA01BGV#W9

R8A77610DA01BGV#W9

System On Chip


  • Manufacturer: Renesas Electronics America
  • Origchip NO: 668-R8A77610DA01BGV#W9
  • Package: 449-BGA
  • Datasheet: -
  • Stock: 223
  • Description: System On Chip(Kg)

Details

Tags

Parameters
Package / Case 449-BGA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 400MHz
RAM Size 16KB
Core Processor SH-4A
Peripherals DDR
Connectivity CANbus, I2C, SCI, SD, SSI, USB
Architecture MPU

This SoC is built on SH-4A core processor(s).


On this SoC, there is SH-4A core processor.Package 449-BGA is assigned to this system on a chip by the manufacturer.A 16KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design is based on the MPU technique.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.

SH-4A processor.


16KB RAM.
Built on MPU.

There are a lot of Renesas Electronics America


R8A77610DA01BGV#W9 System On Chip (SoC) applications.

  • Measurement testers
  • Deep learning hardware
  • Apple smart watch
  • Special Issue Information
  • Print Special Issue Flyer
  • USB hard disk enclosure
  • Keywords
  • Digital Signal Processing
  • High-end PLC
  • Body control module

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