 
    | Parameters | |
|---|---|
| Contact Plating | Tin | 
| Mount | Surface Mount | 
| Package / Case | QFN EP | 
| Number of Pins | 16 | 
| Published | 2005 | 
| JESD-609 Code | e3 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 | 
| Number of Terminations | 16 | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -40°C | 
| HTS Code | 8542.39.00.01 | 
| Terminal Position | QUAD | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 1.8V | 
| Terminal Pitch | 0.5mm | 
| Frequency | 300MHz | 
| Time@Peak Reflow Temperature-Max (s) | 30 | 
| Pin Count | 16 | 
| Operating Supply Voltage | 1.8V | 
| Temperature Grade | INDUSTRIAL | 
| Max Supply Voltage | 1.9V | 
| Min Supply Voltage | 1.7V | 
| Telecom IC Type | TELECOM CIRCUIT | 
| Height | 950μm | 
| Length | 3mm | 
| Width | 3mm | 
| Radiation Hardening | No | 
| RoHS Status | RoHS Compliant |