 
    | Parameters | |
|---|---|
| Package / Case | TFBGA | 
| Surface Mount | YES | 
| Number of Pins | 64 | 
| JESD-609 Code | e1 | 
| Moisture Sensitivity Level (MSL) | 1 | 
| Number of Terminations | 64 | 
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | 
| Max Operating Temperature | 85°C | 
| Min Operating Temperature | -30°C | 
| HTS Code | 8542.39.00.01 | 
| Terminal Position | BOTTOM | 
| Terminal Form | BALL | 
| Peak Reflow Temperature (Cel) | 260 | 
| Number of Functions | 1 | 
| Supply Voltage | 1.8V | 
| Terminal Pitch | 0.65mm | 
| Frequency | 13.56MHz | 
| Time@Peak Reflow Temperature-Max (s) | 30 | 
| Temperature Grade | OTHER | 
| Interface | SPI, UART | 
| Telecom IC Type | TELECOM CIRCUIT | 
| Height Seated (Max) | 1.15mm | 
| Length | 5.5mm | 
| Width | 5.5mm | 
| RoHS Status | RoHS Compliant | 
| Lead Free | Lead Free |