PEB 20256 E V2.1
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 388-BBGA |
| Supplier Device Package | 388-BGA (35x35) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Power (Watts) | 3W |
| Voltage - Supply | 3V~3.6V |
| Base Part Number | PEB20256 |
| Function | Multichannel Network Interface Controller (MUNICH) |
| Interface | HDLC, PPP, Serial, TMA |
| Current - Supply | 200mA |
| RoHS Status | Non-RoHS Compliant |
PEB 20256 E V2.1 Overview
Space is saved on the board by using the 388-BBGA package.Packing is done according to the Tray method.Telecommunications equipment is mounted with type Surface Mount.When 3V~3.6V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using 0°C~70°C as the operating temperature can result in reliable performance.By using telecom switching's base part number of PEB20256, it is possible to find more related parts.There is a supply current of 200mA for telecom equipment to operate on.
PEB 20256 E V2.1 Features
Available in the 388-BBGA package
PEB 20256 E V2.1 Applications
There are a lot of Infineon Technologies PEB 20256 E V2.1 Telecom applications.
- Remote wireless modules
- ISDN terminal adapter
- Interfaces to DS3
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Integrated Access Devices
- Frame Relay Switches and Access Devices (FRADS)
- SONET/SDH terminal
- Voice over packet gateways
- Interfaces to E3
- CSU/DSU E1 Interface