PCX755CVZFU400LE
| Parameters | |
|---|---|
| Package / Case | 360-BBGA Exposed Pad |
| Supplier Device Package | 360-PBGA (25x25) |
| Operating Temperature | -40°C~110°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | PCX755 |
| Speed | 400MHz |
| Core Processor | PowerPC |
| Voltage - I/O | 2.5V 3.3V |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RoHS Status | Non-RoHS Compliant |
PCX755CVZFU400LE Overview
Since the microprocessor is packed in 360-BBGA Exposed Pad, shipping overseas is convenient. High reliability is provided by the advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. Understand the operating temperature around -40°C~110°C TJ. PowerPC processors are embedded in this CPU. 2.5V 3.3V is the CPU's I/O address. Use PCX755 when searching for variants of the embedded microprocessor. A supplier offers a 360-PBGA (25x25) package.
PCX755CVZFU400LE Features
PowerPC Core
PCX755CVZFU400LE Applications
There are a lot of Microchip Technology PCX755CVZFU400LE Microprocessor applications.
- Office automation equipment and computer peripherals
- Gas monitoring systems
- Torpedo guidance
- Network application field
- DDC control
- Heater/Fan
- Dryers
- Auto-breaking system
- DCS control intelligent sensor
- ECG machine