Parameters |
Factory Lead Time |
4 Weeks |
Contact Material |
Phosphor Bronze |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Housing Material |
Nylon |
Material - Insulation |
Polyamide (PA66), Nylon 6/6 |
Operating Temperature |
-55°C~125°C |
Packaging |
Tube |
Published |
2009 |
Series |
PCI Express® (PCIe) |
JESD-609 Code |
e3 |
Feature |
Board Guide |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder, Staggered |
ECCN Code |
EAR99 |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
36 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Additional Feature |
ROHS COMPLIANT |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.039 1.00mm |
Total Number of Contacts |
36 |
Orientation |
Straight |
Depth |
11mm |
Current Rating |
2.5A |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Number Of PCB Rows |
4 |
Body Breadth |
0.339 inch |
UL Flammability Code |
94V-0 |
Contact Style |
BELLOWED TYPE |
Card Type |
PCI Express™ |
Read Out |
Dual |
Body/Shell Style |
SOCKET |
Contact Pattern |
RECTANGULAR |
Mating Contact Row Spacing |
0.04 inch |
Length |
25mm |
Width |
7.5mm |
Contact Finish Thickness |
Flash |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
PCIE-036-02-F-D-TH Overview
A package was prepared according to Tube's specifications.It is recommended to use mounting type Through Hole.Devices are connected through connector sockets CARD EDGE CONNECTOR.Features: Board Guide.It indicates the series of the device by the PCI Express? (PCIe).The following additional features are included in this chip: ROHS COMPLIANT
PCIE-036-02-F-D-TH Features
PCI Express? (PCIe) series
PCIE-036-02-F-D-TH Applications
There are a lot of Samtec Inc. PCIE-036-02-F-D-TH Edgeboard Connectors applications.
- Digital beam-forming systems for ultrasound
- Micro and pico cell systems, software radios
- Wireless and wired broadband communications
- Broadband data applications
- RADAR processing, digital oscilloscopes
- Communication Systems
- Music recording
- Data Acquisition Systems
- Medical Imaging
- Digital signal processing