PA0184

PA0184

TO-263-3 DDPAK/D2PAK TO DIP-6 SM


  • Manufacturer: Chip Quik Inc.
  • Origchip NO: 138-PA0184
  • Package: -
  • Datasheet: PDF
  • Stock: 489
  • Description: TO-263-3 DDPAK/D2PAK TO DIP-6 SM (Kg)

Details

Tags

Parameters
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Package Accepted TO-263 (DDPAK/D2PAK)
Published 2009
Series Proto-Advantage
Size / Dimension 0.700 x 0.300 17.78mmx7.62mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 3
Pitch 0.100 2.54mm
Proto Board Type SMD to DIP
Board Thickness 0.062 1.57mm 1/16
RoHS Status ROHS3 Compliant
See Relate Datesheet

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