PA0170-S

PA0170-S

MINI SOIC-8 EXP PAD STENCIL


  • Manufacturer: Chip Quik Inc.
  • Origchip NO: 138-PA0170-S
  • Package: -
  • Datasheet: PDF
  • Stock: 643
  • Description: MINI SOIC-8 EXP PAD STENCIL (Kg)

Details

Tags

Parameters
Material Stainless Steel
Published 2009
Series Proto-Advantage PA
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Mini SOIC
Number of Positions 8
Pitch 0.026 0.65mm
Outer Dimension 1.300 L x 0.900 W (33.02mm x 22.86mm)
Thermal Center Pad 0.315 L x 0.067 W (8.00mm x 1.70mm)
Thickness 0.0040 0.102mm
Diameter - Inner 0.118 L x 0.118 W (3.00mm x 3.00mm)
RoHS Status ROHS3 Compliant
See Relate Datesheet

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