Parameters |
Factory Lead Time |
6 Weeks |
Lifecycle Status |
ACTIVE (Last Updated: 6 days ago) |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
256-BGA |
Number of Pins |
256 |
Operating Temperature |
-40°C~105°C TJ |
Packaging |
Tray |
Series |
OMAP-L1x |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory |
Other Microprocessor ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.2V |
Frequency |
375MHz |
Base Part Number |
OMAPL137 |
Interface |
SPI, USB |
Max Supply Voltage |
3.45V |
Min Supply Voltage |
900mV |
Memory Size |
32kB |
Number of I/O |
128 |
RAM Size |
128kB |
Memory Type |
Cache |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER |
Core Processor |
ARM926EJ-S |
Data Bus Width |
32b |
Number of Timers/Counters |
2 |
Core Architecture |
ARM |
Boundary Scan |
YES |
Low Power Mode |
YES |
Format |
FLOATING POINT |
Integrated Cache |
YES |
Voltage - I/O |
1.8V 3.3V |
Ethernet |
10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
USB |
USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
Additional Interfaces |
HPI, I2C, McASP, MMC/SD, SPI, UART |
Max Junction Temperature (Tj) |
105°C |
Co-Processors/DSP |
Signal Processing; C674x, System Control; CP15 |
Number of Cores |
1 |
Number of PWM Channels |
3 |
Barrel Shifter |
NO |
Internal Bus Architecture |
SINGLE |
Ambient Temperature Range High |
85°C |
Display & Interface Controllers |
LCD |
Height |
2.05mm |
Length |
17mm |
Width |
17mm |
Thickness |
1.36mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
OMAPL137DZKBA3 Overview
The embedded microprocessor ships overseas conveniently packed in 256-BGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width of the CPU is 1 Core 32-Bit . Recognize operating temperatures around -40°C~105°C TJ. In the series OMAP-L1x, it is found. Core-wise, this CPU has a ARM926EJ-S processor. The CPU uses SDRAM RAM controllers. Featuring HPI, I2C, McASP, MMC/SD, SPI, UART interfaces, this microprocessor can better serve you. 1.8V 3.3V is the I/O speed of this CPU. As far as the uPs/uCs/Peripheral ICs type is concerned, this is a DIGITAL SIGNAL PROCESSOR, OTHER. You can search for variants of a microprocessor with OMAPL137. In total, 256 terminations have been made. Turning on and running the embedded microprocessor with a 1.2V voltage supply should be possible. 375MHz is the CPU's frequency. Datasheets for 256 pin functions can be found here. As a Other Microprocessor ICs, this cpu microprocessor is typical. For data transfer, there is 32b bandwidth available. There are 1 cores in this CPU. Surface Mount mounted, this CPU is widely used in many applications. The amount of RAM (Random-Access Memory) is designed 128kB. The embedded microprocessor should not be supplied with a voltage higher than 3.45V. The lowest voltage fed to the CPU microprocessor should be 900mV. By using 128 I/Os, CPU programs transfer data. A CPU has a memory size of 32kB bytes. The CPU's idle time can be determined by 2 counters.
OMAPL137DZKBA3 Features
ARM926EJ-S Core
32b-Bit Data Bus Width
1-Core CPU
128kB RAM
128 I/Os
OMAPL137DZKBA3 Applications
There are a lot of Texas Instruments OMAPL137DZKBA3 Microprocessor applications.
- Christmas lights
- Multi-meter
- Automatic control
- Walkie talkies
- Dishwashers
- Food and beverage
- Communication-bluetooth, Wi-Fi, radio
- Projectors
- Paper shredders
- Copiers